Senior Packaging Engineer
Oxford, Oxfordshire, South East
IC Resources
to join the photonics operations team. The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture. Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors. … will include: Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etc Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development. Photonics packaging experience desirable Strong communication skills Master’s degree in a relevant technical fieldPlease contact Rachel more »
Employment Type: Permanent
Posted: