7 of 7 Finite Element Analysis Jobs in the East of England

Mechanical Engineer

Hiring Organisation
Gerrell & Hard
Location
great yarmouth, east anglia, united kingdom
development and introduction of advanced microelectronic products for demanding oil and gas applications. This role combines hands-on mechanical engineering, thermal and stress analysis, and new product introduction (NPI). You will play a key role in taking products from initial prototype through qualification and into repeatable, high-quality … Microelectronics, electronic packaging or hybrid electronic assemblies. Ceramic substrates, die attach, wire bonding or specialist electronic packaging techniques. Finite element analysis (FEA) involving thermal stress, vibration or other mechanical loading. Product development for high-temperature, harsh-environment or safety-critical applications. Process FMEA, control plans, process qualification ...

SP Senior Systems Engineer

Hiring Organisation
Lockheed Martin
Location
Bedford, Bedfordshire, United Kingdom
Salary
£ 55 K
teams and developments (e.g. Agility, Sprints, Kanbans).Using collaborative teamworking tools (sharepoint, JIRA, Confluence).M&S studies such as Computational Fluid Dynamics, trajectory modelling, Finite Element Analysis or the application of complex algorithms to engineering challenges.Desired SkillsSuitable candidates may have proven experience of following systems activities:Requirements ...

Mechanical Engineer - Microelectronic Products

Hiring Organisation
Redline Group Ltd
Location
Milton Keynes, Buckinghamshire, Southtown, Norfolk, United Kingdom
Employment Type
Permanent
Salary
£65000 - £70000/annum
Mechanical Engineer - Microelectronic Products job based in Milton Keynes, Buckinghamshire will experience in the following areas: Practical experience performing thermal and stress analysis and interpreting results to inform engineering decisions. Proficiency in SOLIDWORKS for 3D modelling and engineering drawings, and SOLIDWORKS Simulation for thermal and stress analysis, with … material properties and their effects on product performance. Experience with microelectronics, electronic packaging, hybrid assemblies, ceramic substrates, die attach or wire bonding. Experience with finite element analysis for thermal stress, vibration or other mechanical loading. Experience developing products for high-temperature or harsh-environment applications. This ...

Mechanical Engineer - Microelectronic Products

Hiring Organisation
Redline Group Ltd
Location
Great Yarmouth, Norfolk, East Anglia, United Kingdom
Employment Type
Permanent, Work From Home
Salary
£70,000
Mechanical Engineer - Microelectronic Products job based in Milton Keynes, Buckinghamshire will experience in the following areas: Practical experience performing thermal and stress analysis and interpreting results to inform engineering decisions. Proficiency in SOLIDWORKS for 3D modelling and engineering drawings, and SOLIDWORKS Simulation for thermal and stress analysis, with … material properties and their effects on product performance. Experience with microelectronics, electronic packaging, hybrid assemblies, ceramic substrates, die attach or wire bonding. Experience with finite element analysis for thermal stress, vibration or other mechanical loading. Experience developing products for high-temperature or harsh-environment applications. This ...

Audio DSP Engineer

Hiring Organisation
Platform Recruitment
Location
Cambridge, United Kingdom
Deep understanding of microphones, loudspeakers and acoustic system design. Hands-on experience with acoustic test equipment (Audio Precision, HATS) and simulation tools (COMSOL/FEA). Proficiency in DSP concepts and tuning, ideally with MATLAB, Python or C/C++. You’ll be part of a small, specialist audio group ...

Director of Semiconductor Packaging

Hiring Organisation
Intellectual Capital Resources
Location
Cambridge, Cambridgeshire, United Kingdom
Salary
£ 70 K
thermal testing Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs Conduct first-article inspection and failure analysis Provide packaging expertise to Applications Engineering and customers Contribute significantly to the product and technology roadmap Build external networks and maintain awareness of state … Wire bonding Copper clip PCB embedding Chip metallisation Strong 3D CAD experience and knowledge of supplier design rules/DFM Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent Experience with thermal characterisation of semiconductor packages Experience with package qualification/reliability testing, including ...

Principal DSP Engineer

Hiring Organisation
Platform Recruitment
Location
Cambridge, Cambridgeshire, United Kingdom
Employment Type
Permanent
Salary
£70000 - £85000/annum
audio product development, with a strong focus on micro-acoustics Deep understanding of electro-acoustic transducers Proven experience with acoustic simulation software (COMSOL, FEA) Proficiency in a programming/scripting language (MATLAB, Python) for data analysis Nice to have skills for a Principal DSP Engineer: Experience tuning DSP algorithms ...