Director of Semiconductor Packaging

A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors.
The role combines technical leadership, people leadership and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.
Key Responsibilities
Lead the design and development of high-performance, high-density semiconductor packages for GaN power products
Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes
Balance electrical, thermal, mechanical, cost, quality and form-factor requirements
Lead packaging development with overseas assembly houses and technology suppliers
Support package verification, qualification, reliability and thermal testing
Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs
Conduct first-article inspection and failure analysis
Provide packaging expertise to Applications Engineering and customers
Contribute significantly to the product and technology roadmap
Build external networks and maintain awareness of state-of-the-art semiconductor packaging
Essential Experience & Skills
Degree or higher in Engineering, Physics, Materials Science or a related discipline
Strong experience designing and manufacturing high-volume semiconductor power packages, including working with overseas assembly houses
Deep knowledge of packaging technologies including:
Die attach / Ag-sintering
Flip-chip
Wire bonding
Copper clip
PCB embedding
Chip metallisation
Strong 3D CAD experience and knowledge of supplier design rules/DFM
Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent
Experience with thermal characterisation of semiconductor packages
Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards
Strong cross-functional leadership and supplier-management skills
Ability to manage priorities independently and deliver results
Confident presenting technical results to internal and external stakeholders
Please contact Rachel Anderson for further details.