Director of Semiconductor Packaging
- Hiring Organisation
- Intellectual Capital Resources
- Location
- Cambridge, Cambridgeshire, United Kingdom
- Salary
- £ 70 K
Strong 3D CAD experience and knowledge of supplier design rules/DFM Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent Experience with thermal characterisation of semiconductor packages Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant ...