Lead Mechanical Engineer – Electronic Packaging & Thermal
- Location
- Horsham, England, United Kingdom
Technologies seeks a technical team leader to develop new mechanical technologies and packaging solutions for broadband fiber optic and RF devices. You will mentor junior engineers and guide a product development team from concept through release. The role requires strong CAD skills (2D/3D), GD&T, thermal analysis … experience with fabrication processes. You will collaborate with cross-functional teams and suppliers to deliver cost-effective mechanical parts and assemblies. #J-18808-Ljbffr ...