3 of 3 Permanent Finite Element Analysis Jobs in Norfolk

development and introduction of advanced microelectronic products for demanding oil and gas applications. This role combines hands-on mechanical engineering, thermal and stress analysis, and new product introduction (NPI). You will play a key role in taking products from initial prototype through qualification and into repeatable, high-quality … Microelectronics, electronic packaging or hybrid electronic assemblies. Ceramic substrates, die attach, wire bonding or specialist electronic packaging techniques. Finite element analysis (FEA) involving thermal stress, vibration or other mechanical loading. Product development for high-temperature, harsh-environment or safety-critical applications. Process FMEA, control plans, process qualification ...

Mechanical Engineer - Microelectronic Products job based in Milton Keynes, Buckinghamshire will experience in the following areas: Practical experience performing thermal and stress analysis and interpreting results to inform engineering decisions. Proficiency in SOLIDWORKS for 3D modelling and engineering drawings, and SOLIDWORKS Simulation for thermal and stress analysis, with … material properties and their effects on product performance. Experience with microelectronics, electronic packaging, hybrid assemblies, ceramic substrates, die attach or wire bonding. Experience with finite element analysis for thermal stress, vibration or other mechanical loading. Experience developing products for high-temperature or harsh-environment applications. This ...

Mechanical Engineer - Microelectronic Products job based in Milton Keynes, Buckinghamshire will experience in the following areas: Practical experience performing thermal and stress analysis and interpreting results to inform engineering decisions. Proficiency in SOLIDWORKS for 3D modelling and engineering drawings, and SOLIDWORKS Simulation for thermal and stress analysis, with … material properties and their effects on product performance. Experience with microelectronics, electronic packaging, hybrid assemblies, ceramic substrates, die attach or wire bonding. Experience with finite element analysis for thermal stress, vibration or other mechanical loading. Experience developing products for high-temperature or harsh-environment applications. This ...