Packaging Engineer
- Location
- Wales, United Kingdom
integration, chiplet-based architectures, and system-in-package technologies. Working within multidisciplinary engineering teams, the role will contribute to packaging development from requirements analysis and conceptual design through modelling, assembly, prototyping, and testing. The position combines packaging engineering expertise with a systems-level approach to translate innovative semiconductor … design of packaging structures incorporating advanced substrates, interposers, high-density interconnects, microbumps, TSVs, and emerging integration technologies. Analyse electrical, thermal, mechanical, and assembly requirements to support robust packaging designs and resolve technical integration challenges. Technology Development and Prototyping Support packaging development activities from technical requirements and concept definition ...