Director of Semiconductor Packaging
- Hiring Organisation
- Intellectual Capital Resources
- Location
- Cambridge, Cambridgeshire, UK
- Employment Type
- Full-time
Strong 3D CAD experience and knowledge of supplier design rules/DFM Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent Experience with thermal characterisation of semiconductor packages Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant ...