1 to 4 of 4 Cadence Jobs in the East of England with Remote Work Options

offered with this role. Required skills for the Principal Semiconductor Packaging Engineer will include: Strong IC semiconductor packaging experience and knowledge Advanced packaging knowledge Cadence EDA tool experience SI/EMC analysis experience Strong communication skills and a start-up mentality Degree qualified Please contact Rachel Anderson for further more »

offered with this role. Required skills for the Principal Semiconductor Packaging Engineer will include: Strong IC semiconductor packaging experience and knowledge Advanced packaging knowledge Cadence EDA tool experience SI/EMC analysis experience Strong communication skills and a start-up mentality Degree qualified Please contact Rachel Anderson for further more »

months. Responsibilities & Experience: Excellent ATPG/MBIST skills are required. Experience building a new flow from scratch. Must be familiar with Synopsys/Cadence/Mentor industry standard toolsets. Previous experience of EDA tool specification/procurement is nice to have Strong ATE bring up and production support skills. more »

team player with good interpersonal skills, and excellent communication skills, including verbal, written and communication, and presentation skills in English. Very good knowledge of Cadence tool workflow for schematic capture and layout XL. Very good knowledge in running tool for checking DRC, LVS, ERC and antenna rules and ability … good understanding of electromigration and how to layout a block with high reliability Appreciation and knowledge of parasitic associated with a layout. Knowledge of Cadence SKILL language and PCELL development. At Rakon, we value task-focused problem solvers and self-starters who continuously seek to improve our products and more »