Director of Semiconductor Packaging
- Location
- Cambridgeshire and Peterborough, England, United Kingdom
successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners. Key Responsibilities Lead the design and development of high-performance, high-density semiconductor packages for GaN power products Develop … sintering Flip‐chip Wire bonding Copper clip PCB embedding Chip metallisation Strong 3D CAD experience and knowledge of supplier design rules/DFM Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent Experience with thermal characterisation of semiconductor packages Experience with package ...