where they are given the space to explore and develop their projects. They will have good knowledge of FPGA development in VHDL, particularly in signal and image processing algorithms. They will also need experience of embedded C/C++ and good familiarity with PCB design and layout techniques … particularly utilising OrCAD), together with Linux device driver development. Designs can include low-power microcontrollers to high-rate network processing solutions. Experience of PCB fabrication and testing of related firmware and software would be beneficial, but not essential. As a successful candidate, you will have excellent qualifications with a … the highest level of security clearance. Keywords: Hardware, FPGA, VHDL, SoC, PCB, DSP, RF, Embedded, C, C++, Defence, Surrey, Graduate, PhD, Electronics Engineer, Microcontrollers, SignalProcessing, Image Analysis, RF Signal Filtering, Linux. Another top job from ECM, the high-tech recruitment experts. Even if this job's more »
are seeking a number of Hardware/Software Graduate Engineers to join a leading UK technology consultancy who specialise in the area of digital signalprocessing relating to radio communication systems and associated equipment. You will: be self-motivating, capable of working independently; have a good (1st/… knowledge of PCB design and layout; have knowledge of software development in embedded C/C++. You will be responsible for: simulating and implementing signal and image processing algorithms in VHDL for FPGAs; designing PCBs using FPGAs, SoCs, high speed network interfaces and analogue/RF signalmore »
City Of Bristol, England, United Kingdom Hybrid / WFH Options
Milbotix
system. Good understanding of wireless protocols, particularly Wi-Fi and Bluetooth. Able to develop desktop applications for configuration and test. Fair understanding of digital signalprocessing or bio-signal processing. Practical experience writing unit and/or integration tests for embedded devices. Familiar with Agile methodologies. Benefits more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) • Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) • Hardware Programming: FPGA (i.e. more »
in solving real-world problems. Excellent written and verbal communication skills are essential. Of particular interest is some exposure to, or keen interest in SignalProcessing, Algorithm development and/or Image Processing applications. Internship or Industrial placement experience is highly beneficial. You must be eligible for … to sensitive UK Government projects. The successful Embedded Software Graduates will possess strong low level C and C++ programming skills, some DSP or Image processing experience as well as a good understanding of electronics principles. To match the high level of technical expertise within the company, successful Graduates will more »
architecture definition Software design & implementation Integration and validation test Firmware development Design and implement embedded software Implementing hardware drivers, interfaces, abstractions, state machines, advanced signalprocessing algorithms, application modules and unit tests What your background should look like: Above-average degree in Computer Science, Electrical/Electronics/ more »
to join the UK's leading defence manufacturer on a 12 month contract basis to support the development of large range of products covering signalprocessing, core embedded processing systems and security critical systems. This position would ideally be based within travel range of Stevenage on a more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
Woking, Surrey, South East, United Kingdom Hybrid / WFH Options
CBSbutler Holdings Limited
Python or Java Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of signalprocessing techniques Benefits: This blue chip employer offers a supportive and collaborative work environment, where you will have the opportunity to work on more »
Romsey, Hampshire, South East, United Kingdom Hybrid / WFH Options
CBSbutler Holdings Limited
Python or Java Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of signalprocessing techniques Benefits: This blue chip employer offers a supportive and collaborative work environment, where you will have the opportunity to work on more »
