2 of 2 Design for Manufacturing Jobs in South Wales

Sony UK TEC Limited Overview: Sony UK Technology Centre Limited is the only manufacturing centre for Sony in Europe, and have over 500 highly skilled team players who help create some of the most advanced technology on the global market. The heart of today's operation at Pencoed is centered on the manufacture of high technology Broadcast … and Professional Cameras and Systems including the latest industry leading 4K technology. Alongside this, we provide contract manufacturing solutions for multiple non-Sony branded businesses. This collaborative approach to contract manufacturing has produced many commercial successes over the years, including the best-selling British computer of all time, the Raspberry Pi. Additionally, we are the home … creativity and successfully working within a team to introduce new technologies. Key Responsibilities: Design test systems to specification Schedule workload to deliver test system Provide input during DFM (Design for Manufacture) evaluations Analytical analysis (& presentation) of test data Study of Product Operation Build and introduce test system into production Communicate with designers on technical More ❯

a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems. The Senior Packaging Process Engineer shall be a subject matter expert/specialist leading a projectteam of multidisciplinary … development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high-density interposers, and high-speed interconnect solutions (e.g., micro-bumps, hybrid bonding, through-silicon vias) Design and validate high-speed interconnect solutions as part of heterogeneous integration and system-in-package (SiP) platforms Define and validate interconnect schemes (fine-pitch flip chip, wafer-level packaging … robust assembly process flows, including die attach, underfill, bonding, and encapsulation for 3D stacked and interposer-based packages Lead design-for-manufacturing (DFM) activities in collaboration with internal and external design and product development teams Drive technical DOEs, reliability testing, failure analysis, and statistical process control for advanced packaging More ❯