Director of Semiconductor Packaging
- Hiring Organisation
- Intellectual Capital Resources
- Location
- Cambridge, Cambridgeshire, United Kingdom
- Salary
- £ 70 K
thermal testing Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs Conduct first-article inspection and failure analysis Provide packaging expertise to Applications Engineering and customers Contribute significantly to the product and technology roadmap Build external networks and maintain awareness of state … Wire bonding Copper clip PCB embedding Chip metallisation Strong 3D CAD experience and knowledge of supplier design rules/DFM Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent Experience with thermal characterisation of semiconductor packages Experience with package qualification/reliability testing, including ...