IC Package Design Engineer
- Hiring Organisation
- Jobleads-UK
- Location
- Cambridge, England, United Kingdom
General Summary: About the Role The Central Hardware Systems Team at Qualcomm has an opening for an IC Package Design Engineer. The team is responsible for road mapping, architecting, design methodology, design implementation, and verification for all Qualcomm … understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model. Basic knowledge of substrate manufacturing process, structure, design rules, and material properties. Proven understanding of RF and high-speed interfaces, including DDR, PCIe, UCIE, etc. Experience with ...