Principal Packaging Engineer
- Hiring Organisation
- Intellectual Capital Resources
- Location
- Newport, Isle of Wight, UK
- Employment Type
- Full-time
chiplet, interposer, TSV, high-density interconnect and hybrid bonding development Take packaging concepts from customer requirements through prototyping, demonstrators and qualification Define packaging technology roadmaps and drive long-term innovation Lead multidisciplinary technical projects across design, assembly, thermal and test Develop advanced microelectronic modules and system demonstrators Provide … qualification Support hands-on prototyping and laboratory development Contribute to technical proposals, bids and collaborative R&D programmes Manage technical risks and support technology decisions with customers and partners Requirements Strong experience in advanced semiconductor packaging and heterogeneous integration Expertise in 2.5D/3D packaging, chiplets and advanced ...