Southampton, England, United Kingdom Hybrid / WFH Options
IC Resources
Provide managerial leadership to build knowledge and support the team development. Work closely with the exec team to translate product requirements into hardware team deliverables. Implement designs targeting both FPGA and ASIC using industry standard techniques, including the creation of UVM based testbenches. Lead engineering methodology, processes and design techniques. Nurture professional growth of team members through regular mentoring, coaching … and feedback Skills, Knowledge & Expertise: Track record of building and leading high performing collaborative teams. Expert knowledge of an RTL design (Verilog, SystemVerilog) for complex ASIC/FPGA products. A strong skillset in delivery of digital designs for ASIC and FPGA. Optimisation of timing and hardware resources for high throughput data or signal processing applications. Experience in power management techniques More ❯
able to convey technical concepts to stakeholders. Background in satellite payloads or ground segment RF systems. Experience with digital/RF co-design or SDR-based architectures. Knowledge of FPGA interface and control in RF subsystems. Experience working in international and multi-site teams. BENEFITS: Competitive Basic Salary 6% Employers Contribution + 6% as a salary sacrifice Private Medical Insurance More ❯
to convey technical concepts to stakeholders. Desirable: Background in satellite payloads or ground segment RF systems. Experience with digital/RF co-design or SDR-based architectures. Knowledge of FPGA interface and control in RF subsystems. Experience working in international and multi-site teams. BENEFITS: Competitive Basic Salary 6% Employers Contribution + 6% as a salary sacrifice Private Medical Insurance More ❯
This position is perfect for an FPGA Engineer focused on innovation. You will be ahead of industry trends, collaborating with leading semiconductor companies and top engineers on challenging projects. In this small company, there's no micromanagementjust a focus on great work. Attend meetings when needed, but you have the freedom to design solutions your way click apply for full More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
