Process Engineer – Advanced Semiconductor Packaging
- Location
- North East, England, United Kingdom
supplier evaluation and make/buy decisions Die Attach Process Engineering Develop and optimise processes including silver epoxy, silver sinter and eutectic attach (AuSn) Define process parameters (temperature, pressure, time and atmosphere) Deliver process validation, qualification and reliability testing Characterise bond performance including voiding, bond line thickness and thermal resistance … Support material selection and supplier development Wire Bonding Development Establish and optimise gold wire and ribbon bonding processes (ball and wedge) Define process parameters across varying substrates and metallisation types Perform mechanical testing (pull/shear) and reliability assessments Resolve bonding challenges including intermetallic formation and pad integrity Support fine ...