Principal Packaging Engineer
- Hiring Organisation
- Intellectual Capital Resources
- Location
- Newport, Isle of Wight, United Kingdom
- Salary
- £ 70 K
client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into … Principal position. Responsibilities Architect advanced 2.5D/3D packaging and heterogeneous integration solutions Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development Take packaging concepts from customer requirements through prototyping, demonstrators and qualification Define packaging technology roadmaps and drive long-term innovation Lead multidisciplinary technical projects across ...