to understand existing user needs and translate them into technical requirements and innovative solutions. Conduct research and implement algorithms in areas such as audio signalprocessing, music information retrieval and generative models for music. Optimise machine learning pipelines for better efficiency, scalability, and performance. Stay abreast of the … and development, with a portfolio of projects demonstrating expertise in audio analysis and synthesis. Ability to analyse and manipulate large datasets Solid understanding of digitalsignalprocessing, specifically related to audio and music. Knowledge of data preprocessing and feature engineering techniques Experience with machine learning frameworks and more »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in DigitalSignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This … Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) • Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal … reliability, etc.) • Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signalmore »
