Director of Semiconductor Packaging
- Location
- Cambridgeshire and Peterborough, England, United Kingdom
thermal testing Drive design‐for‐manufacture, design processes and engineering tools to achieve right‐first‐time designs Conduct first‐article inspection and failure analysis Provide packaging expertise to Applications Engineering and customers Contribute significantly to the product and technology roadmap Build external networks and maintain awareness of state … Wire bonding Copper clip PCB embedding Chip metallisation Strong 3D CAD experience and knowledge of supplier design rules/DFM Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent Experience with thermal characterisation of semiconductor packages Experience with package qualification/reliability testing, including ...