Principal Packaging Engineer
Cambridge, England, United Kingdom
Hybrid / WFH Options
Hybrid / WFH Options
IC Resources
Our exciting new technology start-up is currently searching for an experienced, dynamic and self starting IC Packaging Engineer to be responsible for the design of complex packaging solutions for multi-die devices. The role will involve developing and maintaining the architecture of the entire product, as well as … providing expertise within the IC packaging world. Remote and hybrid working can be offered with this role. Required skills for the Principal Semiconductor Packaging Engineer will include: Strong IC semiconductor packaging experience and knowledge Advanced packaging knowledge Cadence EDA tool experience SI/EMC analysis experience Strong communication more »
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