Stevenage, Hertfordshire, South East, United Kingdom Hybrid / WFH Options
Carbon60 - Eng&Tech
to join the UK's leading defence manufacturer on a 12 month contract basis to support the development of large range of products covering signalprocessing, core embedded processing systems and security critical systems. This position would ideally be based within travel range of Stevenage on a more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital SignalProcessing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will …/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction) Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.) Chip-Scale Design: digital, RF … and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability) Hardware Programming: FPGA (i.e. more »
power conversion systems using sound engineering principles and adhering to business standards, practices, procedures, and product/program requirements. Develop and test algorithms for signalprocessing and control of power systems and power electronics components including high frequency switching components. Work closely with embedded software and controls teams … and firmware. Design, test, and troubleshoot analog and digital electronics circuits. Analog circuits designs include analog filters, transistor and op-amp circuits, interface circuits, signal conditioning, AD and DA converters, Power supplies. Digital circuits designs include micro controllers, FPGA, communication interface circuits, logic families and digital memory. Create EMI more »
Romsey, Hampshire, South East, United Kingdom Hybrid / WFH Options
CBSbutler Holdings Limited
Python or Java Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of signalprocessing techniques Benefits: This blue chip employer offers a supportive and collaborative work environment, where you will have the opportunity to work on more »
Woking, Surrey, South East, United Kingdom Hybrid / WFH Options
CBSbutler Holdings Limited
Python or Java Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of signalprocessing techniques Benefits: This blue chip employer offers a supportive and collaborative work environment, where you will have the opportunity to work on more »
for an experienced FPGA Designer to be involved in the development of our growing portfolio of complex FPGA platforms. The portfolio ranges from advanced signalprocessing systems, core embedded processing systems, through to safety and security critical systems. Your role will involve all phases of the FPGA more »
Romsey, Hampshire, South East, United Kingdom Hybrid / WFH Options
CBSbutler Holdings Limited
or Java Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of radar signalprocessing techniques Benefits: This blue chip employer offers a supportive and cooperative work environment, where you will have the opportunity to work on more »
Woking, Surrey, United Kingdom Hybrid / WFH Options
CBS Butler
C++ or JavaScript Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of signalprocessing techniques Benefits: This blue chip employer offers a supportive and collaborative work environment, where you will have the opportunity to work on more »
Romsey, Hampshire, United Kingdom Hybrid / WFH Options
CBS Butler
C++ or JavaScript Familiarity with machine learning and artificial intelligence techniques Experience with simulation tools such as Simulink or Xilinx System Generator Knowledge of signalprocessing techniques Benefits: This blue chip employer offers a supportive and collaborative work environment, where you will have the opportunity to work on more »
candidate will be responsible for architecting, implementing, and testing embedded firmware and software on a variety of platforms, including FPGAs, microcontrollers, microprocessors, and mixed signal designs. Additional skills such as communications data-link design, digital-signalprocessing (DSP) design, system design, experience with technical trade studies, and more »
and cyber and commercial fields, Dynetics provides responsive, cost-effective engineering, scientific, and IT solutions. This challenging position will be responsible for SIGINT data processing and analysis of ground-based weapon systems, working directly with customers on location to provide timely analysis support. The SIGINT and Weapon System Analyst … field that can be used in lieu of two years of applicable experience. Candidate must have: A Top Secret/SCI Clearance Experience with signalprocessing techniques and digital data processing Candidate must be a resident of the North Alabama area or willing to relocate to the … Huntsville - North Alabama, AL area. Desired Skills: Analysis of ground-based weapon systems Digital data processing RF principles and applications Scripting experience with MATLAB/Simulink Python experience Computer skills with both Windows and Unix-based systems Security Requirements: Candidate must be a US Citizen and possess (as well more »
gas and energy sector. Embedded Software Engineer Requirements: Degree Qualified in Electrical Engineering or Computer Science (or relevant) C/C++ and VHDL Digital SignalProcessing (DSP) implementation on small microcontrollers and FPGAs 3+ years experience familiar with OFDM and FEC techniques MATLAB or Octave (Desirable) Analogue Circuit more »
High Wycombe, Buckinghamshire, South East, United Kingdom Hybrid / WFH Options
Professional Technical Ltd
the companies innovation. Your day-to-day as Senior Embedded DSP Engineer will involve embedded DSP programming, contributing to key projects, and building digital signalprocessing algorithms for their entire product lineup. Key responsibilities as Senior Embedded DSP Engineer: Lead the development of embedded DSP code for our more »
Lincoln, Lincolnshire, East Midlands, United Kingdom
MASS Consultants
experience A deep understanding of Physics/Mathematical principles at Degree-level System Design Documentation Modelling systems Coding experience (MATLAB & Simulink) Desirable experience Digital SignalProcessing (DSP) Experience in managing a small team Experience with the FPGA build process for Xilinx targets Requirements Management (Simulink Requirements) Industry knowledge more »
Designers to join our team and contribute to our mission of innovation and excellence. Responsibilities: Design and develop FPGA architectures and implementations for advanced signalprocessing systems, core Embedded processing systems, and safety-critical applications. Collaborate with multidisciplinary teams to define requirements, develop solutions, and integrate FPGA more »
Stevenage, Hertfordshire, South East, United Kingdom
Henderson Scott
Designers to join our team and contribute to our mission of innovation and excellence. Responsibilities: Design and develop FPGA architectures and implementations for advanced signalprocessing systems, core embedded processing systems, and safety-critical applications. Collaborate with multidisciplinary teams to define requirements, develop solutions, and integrate FPGA more »
