high current, and large FPGA technologies. Experience of blind, buried, and filled via techniques. Experience of flexible PCB and interconnecting assemblies. Experience of one or more industry standard toolsets, cadence experience would be advantageous. Skills: (Recommended max 5/statements) Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening requirements. Ability to work to More ❯
PCB designs. Undertake PCB design activities from initial concepts through to generation of manufacturing data packs. Help maintain toolsets and supporting libraries/databases. Key Skillset Proven ability of Cadence Allegro toolset PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs. Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies. More ❯
PCB designs. Undertake PCB design activities from initial concepts through to generation of manufacturing data packs. Help maintain toolsets and supporting libraries/databases. Key Skillset Proven ability of Cadence Allegro toolset PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs. Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies. More ❯
