this role is offered on a purely onsite basis in Edinburgh, but a compressed week of 4 days is available. The end client are looking for both Senior & Principal FPGA engineers who would be responsible for design and development of FP click apply for full job details More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
techniques for large, complex, multi-layer, multi-substrate, PCBs. (Up to 24 layer, 2000+ components) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies Experience of blind, buried, and filled via techniques Experience of flexible PCB and interconnecting assemblies Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening … complex PCB design, including multi-layer, multi-substrate boards with up to 24 layers and 2000+ components Experience with high-speed digital, RF, mixed-signal, high-current, and large FPGA designs, including controlled impedance and advanced via techniques Proficiency in flexible PCB assemblies and integration within complex mechanical and thermal constraints Familiarity with industry-standard design tools and adherence to More ❯
skills You are a trained and experienced LabView developer: working with Core 1, 2 and 3, Performance, OOP, Teststand DIAdem and Git. Additional experience is a plus: Actor Framework, FPGA, Pytorch, Certified LabView Architect Additional coding languages are a plus. Experience with life-sciences instrumentation or a general R&D environment is a plus What we offer We offer you More ❯
level solutions. Proficiency in Project Management or management of sub-contractors. Expertise in one or all of the following areas: Satcom flight hardware Optical communications technology Digitilisation Satcom antennas FPGA's 5g High integrity. Desire to work both autonomously and as part of a team, in an international multicultural environment. Solution oriented mindset, with a customer focused communication skill. Fluent More ❯
Cambridge, Cambridgeshire, United Kingdom Hybrid / WFH Options
Arm Limited
Responsibilities: Define SoC and subsystem performance and analysis requirements. Collaborate with other system architects, system designers, IP teams and analysis teams. Engage with specialists across Arm, from modelling, RTL, FPGA, Silicon and software Explore and challenge the limits of IP and system performance capabilities. Required Skills and Experience : At least 4 years SoC architecture, SoC and/or SW performance More ❯
