analyses mapping integrator needs for maturing‐TRL devices, circuits, and interposers across back‐end EDA capability, advanced packaging architectures, and manufacturing transitions. Maintain CHIMES2 Roadmaps: Develop physical implementation and manufacturing roadmaps (EDA gaps, known‐good‐die test, reliability, yield) benchmarked against IEEE HIR, EU APECS, DARPA NGMM, JEDEC, IPC, SEMI … vendor roadmaps (Siemens, Synopsys, Cadence). Analyze Heterogeneous Integration (HI) Gaps: Evaluate HI EDA gaps (cross‐die timing closure, DfT test access, DfP/backside power delivery, DfTh thermal extraction, and tamper‐evident physical security). Logical‐to‐Physical Handoff: Perform gap analysis where physical execution fails architectural intent (parasitic ...